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6-layer PCB HDI Blind Buried Via Control Board

Model Code: PCB Fabrication
  • Supplier Type: 6-layer PCB
  • Substrate: FR-4
  • Plate thlCkness: 1.6mm
  • copper thickness 0.1mm
  • Minimum Line Width 0.065mm
  • surface treatment HASL
  • No MOQ or MPQ limited.
  • Daily quotes and negotiations.
  • Prototypes quotation within 3h.
  • Flexible payment options.
  • Prototype or mass production order acceptable.
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  • Project Info

A 6-layer PCB HDI (High Density Interconnect) Blind Buried Via Control Board is a type of printed circuit board that is designed for high-performance electronic applications that require a high level of signal integrity and reliability.

Here is a breakdown of some of the key features and specifications of this type of PCB:

  • Layer count: 6 layers – this refers to the number of copper layers that are sandwiched between insulating layers in the PCB.
  • HDI: High Density Interconnect – this refers to the use of advanced PCB manufacturing techniques to achieve a higher density of interconnects (i.e. the connections between components on the board). HDI technology typically involves the use of microvias, which are tiny holes drilled into the PCB layers to create more routing space.
  • Blind/buried vias: Blind vias are holes that are drilled from the top or bottom layer of the PCB and only extend partway through the board, while buried vias are holes that are drilled through multiple inner layers of the PCB but do not extend to the outer layers. The use of blind and buried vias allows for more efficient routing of signals and can help to reduce the size and weight of the board.
  • Control board: This type of PCB is typically used as a control board for complex electronic systems, such as aerospace and defense applications, medical devices, and industrial automation equipment. Control boards are responsible for managing and coordinating the various components and subsystems within a larger system.
  • Other features: Depending on the specific application, a 6-layer PCB HDI Blind Buried Via Control Board may also include other features such as specialized signal and power planes, impedance control, and high-speed signal routing.

Overall, a 6-layer PCB HDI Blind Buried Via Control Board is a highly advanced and specialized type of PCB that is designed for use in demanding electronic applications where reliability, signal integrity, and space efficiency are critical factors.

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Basic introduction

material FR-4 layers Level 6
copper thickness 1oz plate thickness 1.6mm
minimum aperture 0.1mm Minimum line spacing 0.065mm
Minimum Line Width 0.065mm surface treatment HASL

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Best Team

No Matter What Kind Of Pcb Board You Want, Our Trained Designers Can Make lt lnAbout 10-12 Working Days. Emplovees Know The lmportance Of Deadlines, AndTheir Goal ls To Give You Top-Notch Results Within A Specified Time Frame.

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