Flexible PCB Manufacturer
A flexible printed circuit board (PCB) is a PCB that is designed to be flexible rather than rigid, as traditional PCBs are. These boards are made of thin, flexible materials like polyimide or PET (polyethylene terephthalate) and are used in a variety of applications where a traditional PCB would be inconvenient due to space or design constraints.
Flexble PCB Manufacturing Solutions
A flexible PCB, also known as flex prints or flex circuits, is a type of circuit board that can be bent into any desired shape. They're frequently found in high-density, high-temperature applications. Flexible printed circuit boards (PCBs) are ideal for use in compact devices or applications where the PCB must conform to a specific surface because they can be bent, twisted, or folded to fit into a specific shape or space. They are also advantageous in applications where the PCB must be flexible to withstand mechanical stress or vibration. Common applications for flexible PCBs include wearable devices, flexible displays, and portable electronic devices. They are also used in the automotive, medical, and military fields. Flexible PCBs are typically created through the etching process, in which a thin layer of copper is applied to the surface of the flexible material and then patterned with photolithography and etching to create the desired circuit traces. A protective layer is then applied to the flexible PCB to prevent corrosion and damage.
We can provide to...
- Turn times as short as 24 hours
- 1 to 100,000 units
- Class II Inspection standard and Class III Inspection available
- 100% on-time guarantee
- DFM support
- Lead free (RoHS) options
- SMT and thru-hole capabilities
- All SMT machine placed
- AOI (Automated Optical Inspection)
- Lead-free RoHS Certification and ITAR compliance screen available
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Program Design
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flex Board Capability
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PCB manufacturing Capabilities
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Equipment Exhibition
From component purchasing to function test and package finish , we provide one shop stop services for every types of PCB.
flex Board Capability
Layer Count | 1-6L 1-4 L normal |
Board Thickness | 0.1-0.5mm (1-4L) 0.6-0.8mm (5-6L) |
The tolerance of 1L board thickness | ±0.03mm |
The tolerance of 2L board thickness | ±0.03mm |
The tolerance of multilayer board thickness | ±10% (Normal ±0.1mm) |
The tolerance of multilayer board thickness | ±10% (Normal ±0.05mm) |
The tolerance of board thickness | ±10% (Normal ±0.1mm) |
The tolerance of board thickness | 9inch*23inch(PI≥1mil) 9inch*14inch (normal) |
Max finished board size | 2mm*4mm(no connection tab);8mm*8mm(with connection tab) |
Min finished board size | 生益 SF305: PI=0.5mil, 1mil, 2mil; Cu=0.33OZ, 0.5OZ, 1OZ |
Adhesive flex core | 杜邦AP:PI=1mil,2mil,3mil,4mil;Cu=0.5oz,1oz, 2oz |
Adhesiveless core | 杜邦AP:PI=1mil,2mil,3mil,4mil;Cu=0.5oz,1oz, 2oz |
Thermosetting adhesive | 杜邦LF:0110,0210 |
PI stiffener | 台虹 MHK 系列: PI=3mil, 5mil , 7mil, 9mil |
3M tape | 9077,9460 |
Finished copper thickness 12um / 18um | 3/3mil |
Finished copper thickness 35um | 4/3.5mil |
Finished copper thickness 70um | 6/5mil |
Solder mask bridge min. (copper thickness<=1oz) | 4mil(Green),5mil(White),8.0mil(big copper area) |
Solder mask opening (single side) | 6mil,8mil(big copper area) |
Solder mask opening of NPTH (single side) | 3mil(partial2.5mil) |
Min. coverlay bridge | 8mil |
Finished copper thickness 12um / 18um | 5/5mil (after compensation) |
Finished copper thickness 35um | 6.5/5mil (after compensation) |
Finished copper thickness 70um | 10/8mil (after compensation) |
Min. Inner layer annual ring width | 4mil(<4L),7mil(4-6L),9mil(7-8L) |
The min distance between inner layer isolated pad and copper area | 3.5mil 4mil normal |
Max finished inner layer copper thickness | 3oz 2 oz normal |
Finished copper thickness, before compensation | 3/3mil |
Finished copper thickness 35um, before compensation | 3.5/3.5mil |
Finished copper thickness 70um, before compensation | 5.5/5mil |
Finished copper thickness 35um, | 3mil(<2mm);4mil(2-4.5mm) |
Finished copper thickness 35-70um, | 5mil(<2mm);6mil(2-4.5mm) |
Finished copper thickness >70um, | 7mil(<2mm);10mil(2-4.5mm) |
Min the distance between NPTH edge to external conductor before compensation | 4oz 2 oz normal |
Max finished external copper thickness | 8mil 5mil(Gold finger area) |
The max board thickness for 0.15mm drill bit | 0.8mm |
Min laser hole diameter | 0.1mm |
Min finish half PTH via diameter | 0.3mm |
Min NPTH tolerance | ±2mil(limit+0,-2mil or +2mil,-0) |
Min space between via hole walls in different net, before compensation | 10mil(after compensation) 12mil (normal)(after compensation) |
Tolerance of stiffener tape | ±0.1mm (Normal ±0.2mm) |
Tolerance of Coverlay | ±2mil ((Normal ±4mil) |
Min distance between coverlay opening and conduct | 3mil ((Normal 4mil) |
PCB manufacturing Capabilities
Normal Tg FR4(Halogen free) | Shengyi S1150 |
High Tg FR4(Halogen free) | Shengyi S1165 |
HDI PCB material | LDPP(IT-180A 1037,1086)、Normal 106,1080 |
High Tg FR4 | Isola:FR408、FR408HR、IS410、FR406、GETEK、PCL-370HR |
Ceramic Particle Filled Laminates | Rogers:Rogers4350、Rogers4003;Arlon:25FR、25N; |
PTFE Laminates | Rogers、Taconic、Arlon、Nelco、TP |
PTFE PP | Taconic:TP、TPN、HT1.5(1.5mil)、Fastrise |
Rigid PCB | Back board、HDI、 |
Blind&buried via type | Laminating≤3 times |
HDI PCB | 1+n+1、1+1+n+1+1、2+n+2、3+n+3 |
Lead free | Flash gold、ENIG |
aspect ratio | 10:01:00 |
Max finished size | HAL Leaded 22"*39" |
MIN finished size | HAL Leaded 5"*6" |
PCB thickness | HAL Leaded0.6-4.0mm; |
MAX high to gold finger | 1.5inch |
Min space between gold fingers | 6mil |
Min block space to gold fingers | 7.5mi |
Max lamination cycle | 3 times |
Min laser drill for stacked via | 0.1mm |
Min stacked via pad size | 0.3mm |
Max laser drilling size | 0.15mm |
Blind Via Finished Hole Size | 0.3mm |
Buried Via Finished Hole Size | 0.3mm |
Non Conductive Filled Vias | 0.2mm~0.8mm |
Conductive Filled Vias | 0.2~0.8mm |
ENIG (Electroless Nickel/Immersion Gold) | AU: 0.05~0.1um Nickel: 3~5um |
Hard gold | 0.1~1.0um |
Soft gold | 0.1~1.0um |
Lead Free HASL | 2~40um |
Flash gold(electroplated gold) | Au 0.025-0.10um,Nickel 3~5um |
electroplated Gold finger | Au 0.25-1.0um Nickel 3~5um |
Selective Gold | Au 0.25-1.0um Nickel 3~5um |
Tin Nickel | N/A |
Immersion Silver | 0.2~0.4um |
Soldermask | min. 8um, max. 30um |
Min mechanical hole 4mil/6mil/8mi | 0.8mm/1.5mm/2.5mm |
Finshed mechanical hole size | 0.1~6.0mm |
MAX aspect ratio for Hole | 12:01:00 |
Max aspect ratio for mechanical depth- control | 1.3:1 |
Min. depth of Mechanical depth- control(backdrill) | 0.2mm |
Min gap between hole wall conductor | 7mil |
Min space between laser holes and conductor | 5mil |
Min space bwteen hole walls in different net | 12mil |
Min space bwteen hole walls in same net | 8mil |
Min space bwteen NPTH hole walls | 10mil |
Hole location tolerance | '+/-3mil |
NPTH tolerance | '+/-0.05mm |
Pressfit holes tolerance | '+/-0.05mm |
Countersink depth tolerance | '+/-0.15mm |
Countersink hole size tolerance | '+/-0.15mm |
Min Pad size for laser drillings | 0.25mm |
Min Pad size for mechanical drilling | 0.4mm |
Min Pad size for mechanical drilling | 0.3mm |
Min BGA pad size | 0.4mm |
Pad size tolerance(BGA) | '+/-2mil |
Min lead pitch | 0.3mm |
Min BGA ball pitch | 0.3mm |
Internal Layer | 1/3OZ: N/A |
Internal Layer | 1/2OZ: 3.5/3.5mil |
Internal Layer | 1OZ: 3/4mil |
Internal Layer | 2OZ: 4/5mil |
External Layer | 1/3OZ: 3/3mil |
External Layer | 1/2OZ:3.5/3.5mil |
Width tolerance | ≤10mil:+/-20% |
Min copper pour to Pour | 7mil |
Min copper pour to trace | 4mil |
Min copper pour to microvia | 8mil |
Min copper pour to buired via | 4mil |
Min copper pour to SMD Pad | 5mil |
Min copper pour to PTH Pad | 5mil |
Soldermask color | Semi Gloss greeen\Gloss Green\Matte Green\Black\Red\Blue\Yellow |
Solder Mask Min Dam Size | 4mil |
Solder Mask Min Dam Size in BGA Area | 4mil |
Solder Mask Registration | '+/-4mil |
Silkscreen color | White, yellow , black |
Min width of soldermask bridge | White, yellow , black |
Min width of soldermask bridge | 4mil |
Min. Diameter Rout Cutter Available | 0.6mm |
Routed Part Size Tolerance | '+/-0.15mm |
V-CUT symmetrical tolerance | '+/-0.1mm |
MAX V-CUT lines | 80 lines |
V-CUT angle tolerance | '+/-5 degress |
V Score, Edge to Copper | H≤1.0mm:0.3mm(20°)、0.33mm(30°)、0.37mm(45°); |
V Score, Edge to Copper | 1.0<H≤1.6mm:0.36mm(20°)、0.4mm(30°)、0.5mm(45°); |
V Score, Edge to Copper | 1.6<H≤2.4mm:0.42mm(20°)、0.51mm(30°)、0.64mm(45°); |
V-CUT angle | 20、30、45 degree |
Gold finger bevelling | 20、30、45、60 degree |
Gold finger bevelling tolerance | '+/-5 degree |
Min space of gold finger chamfering | 6mm |
Min gap between the side of | 8mil |
Layer count | 1~28 layer |
PCB thickness | 0.4~6..0mm |
PCB thickness tolerance˄Normal | Thickness : ±10%(>1.0mm);±0.1mm(≤1.0mm); |
PCB thickness tolerance˄Special ˅ | Thickness ±0.1mm(≤2.0mm);±0.15mm(2.1-3.0mm) |
Min bow&twist | 0.75% |
Controlled Impedance Tolerance | '+/-10% |
Testing methods | Flying probe testing, Test fixture |
Quality standards | IPC II, IPC III |
PCB Products show
Testing Procedures
Flexible printed circuit boards (FPCBs) are a type of circuit board made of flexible materials such as polyimide or polyester that are used in a variety of electronic applications. A flexible PCB manufacturer’s manufacturing capacity refers to the maximum number of FPCBs that the manufacturer can produce in a given period.
The equipment and technology used, the efficiency of the manufacturing process, and the availability of skilled labor are all factors that can impact a flexible PCB manufacturer’s manufacturing capacity. Some flexible PCB manufacturers may have a higher manufacturing capacity due to the use of advanced equipment and automation, whereas others may have a lower manufacturing capacity due to reliance on manual processes or a smaller workforce.
Flexible PCB manufacturers must carefully manage their manufacturing capacity to meet demand while also maximizing efficiency and profitability. This could include investing in new equipment or technology, training employees, or optimizing the manufacturing process to boost productivity.
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Circuit Board Fabrication and PCB Assembly Turnkey Services
Flexble PCB asked questions
What are flexible PCBs used for?
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Why Choose Us?
WINOW has been providing high-quality PCBs with fast turnaround times and high customer satisfaction since 2018. We are one of China's largest and most skilled board manufacturers.
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Orders for prototypes are processed within 24 hours.
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PCB prototypes and small-batch manufacturing typically take 5-7 working days.
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Small batch production and some PCB prototypes have a 48-hour lead time.